This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; • Various theories or mechanisms of adhesion • Surface (physical or chemical) characterization of materials as it pertains to adhesion • Surface cleaning as it pertains to adhesion • Ways to improve adhesion • Unraveling of interfacial interactions using an array of pertinent techniques • Characterization of interfaces / interphases • Polymer-polymer adhesion • Metal-polymer adhesion (metallized polymers) • Polymer adhesion to various substrates • Adhesion of thin films • Adhesion of underfills • Adhesion of molding compounds • Adhesion of different dielectric materials • Delamination and reliability issues in packaged devices • Interface mechanics and crack propagation • Adhesion measurement of thin films and coatings
