EBOOK
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
Lih-Tyng HwangSeries: IEEE Press(0)
About
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
• Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
• Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
• Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
• Provides chapter-wise review questions and powerpoint slides as teaching tools
• Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
• Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
• Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
• Provides chapter-wise review questions and powerpoint slides as teaching tools
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Extended Details
- SeriesIEEE Press